Metalization - Key words

Cu damasceneCu electroplating, ECD(electro-chemical deposition)Silicide, polycide, SalicideCVD - MOCVD, PECVD, Thermal CVD, ALDPVD - SputteringECD - Cu고려사항(조건)Resistivity, PermittivityReliability - Electro Migration, corrosion, Hillock formationMelting PointStress - Thermal Stress, Intrinsic stress, deposition 공정 별 stress, edge stressJunction spiking - Alloy↓↓↓↓↓↓↓↓↓↓↓↓요구되는 물성1.적은 전기저항, 2.작은 접촉저항, 3.Pattern제작의 용이성, 4.증착의 용이성5.화학적 안정성, 6.기계적 안정성, 7.접착정, 8.공정 중의 안정성ViaPlug - Ohmic contactinterconnection - local / glob..........

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