Mechanical Abrasion by Bi-layered Pad Micro-Asperity in Chemical Mechanical Polishing

제목 Mechanical Abrasion by Bi-layered Pad Micro-Asperity in Chemical Mechanical Polishing 저자 Hyun Jun Ryu, Dong Geun Kim, Sukkyung Kang, Ji-hun Jeong, Sanha Kim 키워드 Abrasion, Polishing, Material Removal Abstract Pad asperities in chemical-mechanical polishing (CMP) provide necessary forces for mechanical abrasion. This article investigates the abrasive behaviour of polishing pads at the asperity contact scale. A contact mechanics model predicts that compliant and soft asperities or rigid and hard...

원문링크 : Mechanical Abrasion by Bi-layered Pad Micro-Asperity in Chemical Mechanical Polishing